Engineered for next-generation Co-Packaged Optics (CPO) and high-density internal interconnection architectures, we deliver professional, high-precision assembly (A'ssy) and end-face polishing services for XPO with e-Ribbon™ products.

To address the challenges of integrating high-density flat ribbon structures with miniature connectors, we have developed specialized curing and fixing processes that ensure precise alignment of multi-fiber arrays within ultra-compact spaces. Utilizing cutting-edge polishing technology and high-standard interferometric inspection, we strictly control end-face geometric parameters and cleanliness to achieve exceptionally low Insertion Loss (IL) and superior Return Loss (RL), providing excellent and stable optical path connectivity for your high-speed modules.